5U DP Intel Xeon PCIe GPU server.
AceleMax® AXG-5210IB
- Support for up to 10 double-width PCIe GPU accelerator
cards - Flexible networking with up to AIOM slots
- Up to 13 PCIe 5.0 x16 FHFL slots
- 16 front hot-swap 2.5” NVMe + 8 front hot-swap 2.5”
NVMe for Storage RDMA
Specifications
Category | Specifications |
---|---|
Form Factor | • 5U Rackmount • Enclosure: 437 x 222.5 x 737mm (17.2" x 8.75" x 29") • Package: 720 x 440 x 1080mm (28.34" x 17.32" x 42.57") |
Processor | • Dual Socket BDR (LGA7529) • Intel® Xeon® 6900 Series Processors • Up to 120/256C; Up to 500MB Cache per CPU |
GPU | • Max GPU Count: Up to 10 double-width or 10 single-width GPUs • Supported GPU: NVIDIA PCIe: H100 NVL, L40S, L4 • GPU-GPU Interconnect: NVIDIA® NVLink® Bridge (optional) |
System Memory | • Slot Count: 24 DIMM slots • Max Memory (IDCP): Up to 6TB 6400MT/s ECC DDR5 RDIMM • Max Memory (TDPC): Up to 6TB 8800MT/s ECC DDR5 RDIMM |
Drive Bays Configuration | • Default: Total 24 bays • 24 front hot-swap 2.5" PCIe 5.0 NVMe drive bays • M.2: 2 x M.2 NVMe slots (M-key) |
Expansion Slots | • Default: 13 PCIe 5.0 x16 FHFL slots |
On-Board Devices | • Chipset: System on Chip • Network Connectivity: 2 RJ45 10GbE with Intel® X710-AT2 |
Input / Output | • LAN: 2 RJ45 10 GbE LAN ports (Intel® I350) • USB: 2 USB 3.0 Type-A ports (Rear) • Video: 1 VGA port |
System Cooling | • Fans: 10 heavy duty fans with optimal fan speed control • Air Shroud: 1 Air Shroud • Liquid Cooling: Direct to Chip (D2C) Cold Plate (optional) |
Power Supply | • 6x 2700W Redundant Titanium Level (96%) power supplies |
System BIOS | • BIOS Type: AMI 32MB SPI Flash EEPROM |
Management | • AMAX Cloud Composer; AMAX Server Manager (ASM); AMAX Diagnostics Office (ADO); AMAX Thin-Client Service (TAS); AMAX Server Automation Assistant (AAA) New! |
PC Health Monitoring | • CPU Monitors for CPU Cores, Chipset Voltages, Memory • 8+4 Phase-switching voltage regulator FAN: Fans with tachometer monitoring • Status Monitor for speed control • Pulse Width Modulated (PWM) fan connectors • Temperature: Monitoring for CPU and chassis environment |
Operating Environment | • Operating Temperature: 10°C - 35°C (50°F - 95°F) • Non-Operating Temperature: -40°C to 70°C (-40°F to 140°F) • Operating Relative Humidity: 8% to 90% (non-condensing) • Non-Operating Relative Humidity: 5% to 95% (non-condensing) |