Amax Engineering

Liquid Cooling for High-Density AI Infrastructure

Design, integrate, and deploy liquid cooling solutions for high-density GPU clusters, rack-scale AI systems, and next-generation AI data centers.

Built for High-Density AI

Modern AI infrastructure demands more power within the same rack footprint. AMAX liquid cooling solutions improve thermal efficiency, support higher rack densities, reduce cooling energy, and maintain consistent GPU performance for training, inference, and rack-scale AI deployments.

Designed for AI Workloads

AMAX liquid cooling solutions support GPU-intensive workloads including large language model training, AI inference, RAG, digital twins, simulation, scientific computing, and industrial AI.

Engineering Beyond the Cooling Loop

AMAX combines thermal engineering, rack integration, compute platforms, networking, storage, and manufacturing into complete liquid-cooled AI infrastructure validated for production deployment.

  • Compute: High-density GPU systems engineered for AI training and inference.
  • Liquid Cooling: Direct-to-chip cooling, CDUs, manifolds, and rack-scale thermal infrastructure.
  • Data Center Integration: Power, networking, storage, commissioning, and operational readiness.

Purpose-Built for Modern AI Data Centers

Understanding that data centers have unique needs, our solutions are tailored to improve operational performance, manage power and cooling more efficiently, and ensure data security and compliance:

  • High-Density GPU Infrastructure: Support higher rack power densities while maintaining thermal stability for AI training and inference.
  • Direct-to-Chip Liquid Cooling: Improve heat transfer efficiency and enable higher GPU utilization with advanced liquid cooling architectures.
  • Rack-Scale Integration: Combine compute, networking, storage, cooling, and power into validated rack-level systems.
  • Energy-Efficiency: Reduce cooling energy consumption while supporting continuous operation under sustained AI workloads.
  • Deployment Services: Site assessment, rack integration, commissioning, thermal validation, and lifecycle support.
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